LY13330-PF doc. no : qw0905- rev. : date : 10 - jul. - 2008 a data sheet LY13330-PF infrared emitting diodes ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -30 30 25% 50% 75%25% 0 100% 50%75% 60 directivity radiation 0 package dimensions ligitek electronics co.,ltd. property of ligitek only 100% -60 2.54typ 1.0min + - 25.0min 6.5 7.2 0.5 typ 1.5max part no. 4.8 5.8 LY13330-PF page 1/5
-40 ~ +100 tstg storage temperature forward voltage @ ma(v) luminous intensity @10ma(mcd) 20 spectral halfwidth #$ nm viewing angle 2 % 1/2 (deg) material peak wave length $ pnm part no gaasp/gap note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. LY13330-PF65 typ. 585 yellow 1.7 352.630 emittedlensmin.max.min. 40 typical electrical & optical characteristics (ta=25 & ) color & page 2/5 reverse current @5v operating temperature peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 & forward current power dissipation parameter 20 ma i f t opr ir -40 ~ +85 10 pd i fp 60 80 & ' a ma mw symbol y ratings unit ligitek electronics co.,ltd. property of ligitek only yellow diffused LY13330-PF part no.
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 550 wavelength (nm) 500 0.0 0.5 600650700 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 40 20 060100 80 ambient temperature( ) -40-20 02060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 y chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 3/5 page forward current(ma) 1.0101001000 LY13330-PF part no.
page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 260 c3sec max 5 /sec max temp( c) 260 150 2 /sec max 0 preheat 100 50 time(sec) 0 25 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max LY13330-PF part no.
1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) thermal shock test solderability test solder resistance test high temperature high humidity test low temperature storage test operating life test high temperature storage test test item the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition description mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only reliability test: 5/5 page LY13330-PF part no.
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